A technique of  thickness gauging and quality control  of semiconductor films (plates) with thicknesses within 0.1--40 mkm of cut-size or roll type is developed on the basis of a two-coordinate laser flaw detector including a personal computer "Pentium III", infrared laser optical  head of CD-RW type with the radiation wavelength lambda = 0.98 mkm, scanning along coordinate X, mobile table along coordinate Y with a film (plate) test specimen and photodetector; control device, photoelectric current amplifier, analog-digital converter, RS-232 interfaces connected with serial ports of  personal computer.
    The technical facilities and the control technique of  the laser flaw detector provide: thickness gauging and quality control  of semiconductor films (plates) with dimensions  (10x10) mkm--(100x100) mm,  thickness within 0.1--40 mkm at 0.1 mkm resolution. The range of  scanning steps along  X, Y coordinates is 2--100 mkm, range of laser beam diameters: 1.7--50 mkm, scanning speed along XY coordinates ≤ 100 mm/s, sensitivity: current  -- 10^-8А, voltage -- 2.5x10^-6 V.  Records  of electronic diagrams of flax or roll films (plates) are saved on hard disk of the personal computer, output of defects onto a monitor and color printer, quantity of color gradations:  32. Resolution of specimen defects =< 0.5 mkm, accuracy of film thickness gauging =< 2%. Application programs are in the Delphi 7.0 language.